Allwinner A64 PCB Layout Guide

About this manual

This guide provides step-by-step instructions for PCB layout of the Allwinner A64 chip, including stack-up configurations, CPU ball fanout, power and ground routing, crystal oscillator placement, memory interfaces, and power management. It also covers interface design for CSI, MIPI, HDMI, USB, and wireless modules, along with ESD and EMC design best practices. The guide is intended for PCB designers to ensure optimal performance and reliability. This manual is written in Chinese.

What's inside

• Stack Up
• CPU Ball Fanout
• A64 Power / GND
• 24MHz Crystal
• Memory (DRAM, NAND, eMMC)
• AXP803 (PMIC & Codec) Power and Audio
• Interface (CSI, MIPI DSI, LVDS, HDMI, USB, HSIC)
• WIFI/BT/GPS
• ESD Design
• EMC Design

Specifications

Frequently asked questions

What is the recommended stack-up for the A64 PCB?

The guide recommends 4-layer or 6-layer board stack-up, with specific layer thickness adjustments for board thickness.

What is the recommended board thickness adjustment method for 4-layer boards?

Adjust the medium thickness between layers 2 and 3.

What is the minimum width for CPU ball fanout lines in the first two circles?

The line width is 4mil.

What is the maximum allowable parasitic capacitance for ESD devices on USB DP/DM signals?

The parasitic capacitance must be less than 5pF.