AEC-Q104 Failure Mechanism Based Stress Test Qualification for Multichip Modules

About this manual

The Automotive Electronics Council (AEC) Q104 specification defines a set of failure mechanism-based stress tests to determine if Multichip Modules (MCMs) can achieve the required quality and reliability levels for automotive use. It specifically applies to MCMs designed to be soldered directly to printed circuit board assemblies, excluding items like LEDs, MEMS, power MCMs, SSDs, or those with exterior connectors.

What's inside

• Scope
• Purpose
• Reference Documents
• Definitions
• Qualification Process
• Assembly Lot Definition

Frequently asked questions

What specific electronic components does this document cover?

This specification applies to multichip modules (MCM) that consist of multiple electronic components enclosed in a single package.

What is the required mounting method for these modules?

The document applies only to multichip modules designed to be soldered directly to a printed circuit board assembly.