This document describes a level translator for SD, SDIO, mini SD, and micro SD cards with internal I/O supply and ±15 kV ESD protection. It supports a clock rate of 60 MHz and DDR mode for SD Card™. It is compliant with SD Specification Part 1 Physical Layer Specification 3.00 (SDR12, SDR25, DDR50) and SD Specification Part 1 Physical Layer Specification 2.00. It is bi-directional with a direction control pin and has balanced propagation delays. It supports both 1.8 V and 2.9 V data translation on the card side and has an integrated LDO to supply power for B-side I/Os. It also has integrated pull-up and pull-down resistors on the B-side. The operating voltage range is VCCA = 1.62 V to 1.98 V and VBAT = 3.0 V to 5.0 V. It has latch-up performance exceeding 100 mA and ESD protection for both the card side and host side. It is available in a space-saving Flip Chip 25 package and is suitable for mobile phones, smartphones, PDAs, and cameras.
The ST6G3244ME is a dual supply, low voltage 6-bit bi-directional CMOS level translator designed for use as an interface between baseband and memory cards. It supports SD, mini SD, and micro SD cards, achieving high-speed operation up to 60 MHz while maintaining low power dissipation. The device features an integrated LDO to supply 1.8 V or 2.9 V power for B-side I/Os and includes EMI filtering and signal conditioning.
| Clock rate | 60 MHz |
|---|---|
| Data rate | 120 Mbps |
| Operating voltage VCCA | 1.62 V to 1.98 V |
| Battery power supply VBAT | 3.0 V to 5.0 V |
| ESD protection (Card side) | ±15 kV air-gap |
| ESD protection (Host side) | ±2 kV HBM |
| Operating temperature range | -40 °C to +85 °C |
| Package | Flip Chip 25 |
It is compliant with SD Specification Part 1 Physical Layer Specification 3.00 (SDR12, SDR25, DDR50) and 2.00.
Yes, the LDO supports power-down; when powered down, VCCB is pulled to GND via a 130 Ω resistor.
The maximum junction temperature is 150 °C.