This application note details the design guidelines for developing an application-specific IEEE 802.15.4 design using an STM32W108xx device.
This application note accompanies reference designs for the STM32W108 family of system-on-chip (SoC) platforms, detailing design decisions and guidelines for developing IEEE 802.15.4-compliant solutions. It is intended to help developers successfully implement designs using STM32W108xx devices by explaining the hardware architecture and specific component choices.
| Document ID | 17406 Rev 3 |
|---|---|
| Publication Date | March 2011 |
| Target Platform | STM32W108xx |
| Protocol Standard | IEEE 802.15.4 |
| Package Type | 48-pin |
| PCB Layers | 4-layer |
| Substrate Material | FR-4 epoxy |
| Balun Ratio | 2:1 |
| Balun Type | Ceramic |
A 2:1 ceramic balun is preferred to offer the lowest network loss.
The optimum load presented to the pins is 27 + j95 Ohms (series impedance).