AN2639 Application note describes the various package types used for microcontrollers, introduces the different mounting technologies, and gives soldering recommendations.
This document details the various lead-free ECOPACK packages available at STMicroelectronics for microcontrollers, covering both Surface Mount Technology (SMT) and Through Hole Technology (THT). It outlines the advantages and disadvantages of SMDs compared to traditional through-hole components.
The guide provides specific recommendations for soldering methods, including single-sided reflow, double-sided reflow, and wave soldering. It details compatibility between different package types (such as PLCC, SOP, QFP, BGA) and soldering processes, along with critical conditions for reflow soldering to ensure device reliability.
| Document ID | 14016 Rev 2 |
|---|---|
| Release Date | May 2009 |
| Preheat temperature rise rate limit | < 2 C/second |
Yes, lead-free packages can be assembled using a leaded soldering process.
No, wave soldering with PLCC, BGA, and VFQFPN is strictly impossible due to the lead/ball configuration.