The file provides POWER DIP 24 20+2+2 product specifications, including package materials, thermal conductivity, thermal resistance, etc.
This document provides technical data for the POWER DIP 24 package, specifically the 20+2+2 lead configuration. It details the package material list, including leadframe, die attach epoxy, and molding epoxy resin properties.
The datasheet includes charts for thermal resistance (Rth) versus time width and on-board heat sink area. It specifies test conditions such as a die size of 120x130 sq.mils and a power dissipation (Pd) of 2 Watt.
| Leadframe material | copper |
|---|---|
| Die attach epoxy thickness | 15-50 um |
| Molding epoxy resin thickness | 3mm |
| Die size | 120x130 sq.mils |
| Test power dissipation | 2 Watt |
The POWER DIP 24 package has a total of 24 leads, arranged as 20 plus 2 plus 2.
The leadframe copper has a stated thickness of 0.25 mm.
The die attach epoxy glue layer is between 15 and 50 micrometers thick.