BGA packages are ideal for low cost, high volume applications where package size and performance is of major importance.
The document introduces the Fine-Pitch Ball Grid Array (FBGA) package as a solution to space and weight requirements in personal computing and portable electronics. It highlights BGA advantages such as smaller size, larger pitch, lack of fragile leads, improved board assembly yields, and better thermal properties compared to QFP or TSSOP packages.
The note provides detailed routing techniques for different bit-count devices (18-bit, 24-bit, 32-bit, 36-bit, 40-bit, and 48-bit) using specific Fairchild models like the 74LCX16500 and FST32211. It also covers power and ground routing methods via vias under or outside the package, as well as advanced via types including blind, buried, and micro vias for high-density designs.
BGAs are usually smaller, have larger pitch, and lack fragile leads that cause yield and rework problems.
Fairchild Semiconductor BGA products are designed around a JEDEC standard 0.8mm ball pitch.
The document uses the 74VCX32500 as an example for 114-Ball 36-Bit BGA Routing.