This document outlines the key advantages of IMST Hybrid ICs, focusing on excellent heat dissipation due to their aluminum substrate, high reliability through reduced soldering points, and superior electromagnetic shielding. The technology allows for direct mounting of semiconductor bare chips and functional bonding with aluminum wires.
The text provides a comprehensive lineup of audio power amplifier ICs within the STK series, covering various output powers from 1W to 200W per channel. It details specific model characteristics including Total Harmonic Distortion (THD), load impedance compatibility, pin compatibility across different grades, and thermal stability features designed to prevent thermal runaway.
| Total harmonic distortion | 0.1% to 0.005% |
|---|---|
| Number of channels | 1 to 8ch |
| Load impedance | 1 te 8% |
| Output power (per channel) | 5 to 200W |
It applies wiring by mounting semiconductor bare chips directly and bonding aluminum wires, which reduces the number of soldering points.
The output power per channel ranges from 5 to 200W.
Total harmonic distortion can be as low as 0.005%.