WAKEFIELD THERMAL SOLUTIONS EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS

Update: 30 September, 2023

The 621 and 623 Series low-profile flat back heat sinks are a general purpose but efficient heat dissipator for TO-3 and virtually all other styles of metal case power semiconductor package types, finding a wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.) in width, accommodating many types of packages.

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MD5 Checksum: FDF844B6A8D80C3D0289BD01DA588721

Publication date: 09 April, 2012

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