This document introduces the features and characteristics of Micron's 256Mb: x4, x8, x16 DDR SDRAM.
The document provides detailed specifications for three Micron DDR SDRAM parts: the 64‑Meg x4 (MT46V64M4), 32‑Meg x8 (MT46V32M8) and 16‑Meg x16 (MT46V16M16) devices. It covers features, package options, timing parameters, command definitions and power‑down behavior.
Key sections include functional description, block diagrams, pin and ball assignments, electrical specifications, command set, and operational modes such as auto‑refresh and power‑down. The data sheet also lists temperature ratings, voltage ranges, and speed‑grade compatibility.
| Capacity | 64 Meg x4 (16 Meg x4 x4 banks) |
|---|---|
| Capacity | 32 Meg x8 (8 Meg x8 x4 banks) |
| Capacity | 16 Meg x16 (4 Meg x16 x4 banks) |
| Voltage (VDD / VDDQ) | 2.6 V ± 0.1 V (DDR400) |
| Temperature rating – Commercial | 0 °C to +70 °C |
| Temperature rating – Industrial | 40 °C to +85 °C |
| Refresh count | 8 K |
| Row address bits | 8 K (A0‑A12) |
| Column address bits | 2 K (A0‑A9, A11) |
The device is internally configured as a 4‑bank DRAM.