This document describes the power dissipation characteristics of QFN-24 and provides power dissipation data under different environmental conditions. The product is mounted on a 40x40mm glass epoxy board and has good heat dissipation performance.
This document provides power‑dissipation information for the QFN‑24 package. The data were measured with the package mounted on a 40 × 40 mm FR‑4 board, natural convection ambient, lead‑free solder, four copper layers, 1.0 mm thickness and four 0.4 mm through‑holes.
A table shows how power dissipation and thermal resistance vary with ambient temperature, e.g., at 25 °C the package can dissipate 1500 mW, while at 85 °C the allowable dissipation drops to 600 mW.
| Board Dimensions | 40 x 40 mm |
|---|---|
| Board Structure | 4 Copper Layers |
| Material | Glass Epoxy (FR-4) |
| Thickness | 1.0 mm |
| Through‑hole | 4 x 0.4 mm Diameter |
| Ambient Condition | Natural convection |
| Soldering | Lead (Pb) free |