QFN-24 Manuals

QFN-24 Power Dissipation Datasheet

This document provides power‑dissipation information for the QFN‑24 package. The data were measured with the package mounted on a 40 × 40 mm FR‑4 board, natural convection ambient, lead‑free solder, four copper layers, 1.0 mm thickness and four 0.4 mm through‑holes.

A table shows how power dissipation and thermal resistance vary with ambient temperature, e.g., at 25 °C the package can dissipate 1500 mW, while at 85 °C the allowable dissipation drops to 600 mW.

Covers: Power Dissipation · Measurement Condition (Reference data) · Power Dissipation vs. Ambient Temperature