Power dissipation data for the LGA-4B01 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition.
This one‑page document presents the power dissipation characteristics of the LGA-4B01 component. The data are intended as reference values measured under defined board and environmental conditions.
Measurements were performed with the device mounted on a 40 × 40 mm FR‑4 board (1.6 mm thick) with 50 % copper coverage on both sides, natural convection cooling, and lead‑free soldering. The table relates ambient temperature to power dissipation and includes the thermal resistance of the assembly.
| Board dimensions | 40 x 40 mm |
|---|---|
| Copper coverage | 50% front, 50% back |
| Board material | Glass Epoxy (FR-4) |
| Board thickness | 1.6 mm |
| Through‑hole size | 4 x 0.8 mm |
| Maximum junction temperature | 125 °C |
The data were taken with the LGA-4B01 mounted on a 40 × 40 mm FR‑4 board, natural convection ambient, lead‑free soldering, 1.6 mm thickness, and copper covering 50 % of both sides.
Power dissipation decreases as ambient temperature rises; for example, at 25 °C the dissipation is 600 mW, while at 85 °C it drops to 240 mW.