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- Languages
- EN
- Last added
- 2012-03-19
Featured LGA-4B01 manuals
LGA-4B01 Power Dissipation Datasheet
This one‑page document presents the power dissipation characteristics of the LGA-4B01 component. The data are intended as reference values measured under defined board and environmental conditions.
Measurements were performed with the device mounted on a 40 × 40 mm FR‑4 board (1.6 mm thick) with 50 % copper coverage on both sides, natural convection cooling, and lead‑free soldering. The table relates ambient temperature to power dissipation and includes the thermal resistance of the assembly.
Covers: Power Dissipation · Measurement Conditions · Power Dissipation vs Ambient Temperature
Latest LGA-4B01 manuals
LGA-4B01 Power Dissipation Datasheet
Datasheet 1 pages · 146 KB · ENProvides power dissipation data for the LGA-4B01 component under specified board mounting conditions.
Which document do I need?
Datasheet
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in LGA-4B01 manuals
What measurement conditions were used for the power dissipation data?
The data were taken with the LGA-4B01 mounted on a 40 × 40 mm FR‑4 board, natural convection ambient, lead‑free soldering, 1.6 mm thickness, and copper covering 50 % of both sides.
How does ambient temperature affect the power dissipation of the LGA-4B01?
Power dissipation decreases as ambient temperature rises; for example, at 25 °C the dissipation is 600 mW, while at 85 °C it drops to 240 mW.