Introduces the characteristics and applications of materials such as QM44, QM22, QM25, QM24, QM17, QM14, QM34
The QM44 Multilayer System is a filled, recrystallizable two‑print dielectric that offers high resistance to EMF‑generated effects such as silver migration and blistering. The guide describes compatible conductors, resistors, encapsulants and recommended materials for each layer of the stack.
Detailed process instructions cover screen selection, printing parameters, furnace firing profiles, encapsulant handling, assembly practices, and design dimension rules to ensure reliable via and trace performance in multilayer circuits.
| Dielectric type | filled, recrystallizable two‑print dielectric |
|---|---|
| Top conductor composition | Ag:Pd (3:1) co‑fireable with QM44 |
| Resistor tolerance | 0.5% end‑of‑life |
| Encapsulant QQ550 peak firing temperature | 520 °C |
| Print speed for QM44 | 4‑6 in/sec (10‑15 cm/sec) |
| Squeegee durometer hardness for QM44 | 60‑80 |
| Minimum via diameter | 0.10 in |
The standard DuPont 30‑minute furnace profile is used, with specific control points such as 850 °C peak for 10 minutes and a 33‑minute total cycle.
The guide specifies a minimum via diameter of 0.10 in.