Key facts
- Manuals
- 1
- Languages
- EN
- Last added
- 2012-02-08
Featured QM44 manuals
DuPont QM44 Multilayer System Process and Design Guide
The QM44 Multilayer System is a filled, recrystallizable two‑print dielectric that offers high resistance to EMF‑generated effects such as silver migration and blistering. The guide describes compatible conductors, resistors, encapsulants and recommended materials for each layer of the stack.
Detailed process instructions cover screen selection, printing parameters, furnace firing profiles, encapsulant handling, assembly practices, and design dimension rules to ensure reliable via and trace performance in multilayer circuits.
Covers: System Introduction · Process Guide · Printing · Firing · Assembly · Design Guide
Latest QM44 manuals
DuPont QM44 Multilayer System Process and Design Guide
Application Note 21 pages · 285 KB · ENA process and design guide for the DuPont QM44 multilayer dielectric system, covering printing, firing, assembly and design dimensions.
Which document do I need?
Application Note
How to use the product for one specific task, with worked examples.
Questions answered in QM44 manuals
What furnace profile is recommended for firing QM44 multilayer dielectrics?
The standard DuPont 30‑minute furnace profile is used, with specific control points such as 850 °C peak for 10 minutes and a 33‑minute total cycle.
From: DuPont QM44 Multilayer System Process and Design Guide
What is the minimum via size allowed in QM44 designs?
The guide specifies a minimum via diameter of 0.10 in.
From: DuPont QM44 Multilayer System Process and Design Guide