Industrial

ST23ZR08 is an enhanced secure microcontroller with 8 Kbytes EEPROM and dual interface from STMicroelectronics, which supports ISO/IEC 14443 Type A, B and B', and PayPass™ standards.

ST23ZR02 is a secure microcontroller with enhanced security, 2 Kbytes EEPROM and dual interface, which is offered by STMicroelectronics.

This document describes the features and characteristics of the ST23ZR04 secure microcontroller, including enhanced security, 4 Kbytes EEPROM, and dual interface.

ST23ZC02 is a secure microcontroller with enhanced security from STMicroelectronics with 2 Kbytes EEPROM and contactless-only interface.

This document describes the features and characteristics of the ST23ZC04 secure microcontroller, including enhanced security, 4K bytes of EEPROM, and a contactless-only interface.

This document describes the hardware features, contactless features, and security features of the ST23ZC08 secure microcontroller. The hardware features include an enhanced 8/16-bit ST23 CPU core, 16 Mbytes of linear addressable memory, 92 Kbytes of User ROM, 4 Kbytes of User RAM, etc. The contactless features comply with ISO/IEC 14443 Type A, B and B', and PayPass™ standards, and operate at a carrier frequency of 13.56 MHz. The security features include active shield, environmental parameter monitoring, protection mechanisms against faults, true random number generator, 16-bit Cyclic Redundancy Check calculation block, unique serial number on each die, AES accelerator, and three-key Triple DES accelerator.

CD21-Rev3 is a transportation dual-interface secure microcontroller produced by STMicroelectronics. Its features are compliance with Calypso 3.0 specification, 4, 8 or 18 Kbytes of EEPROM, Innovatron contactless protocol, 3V and 5V supply voltage ranges, internal CPU clock frequency up to 29 MHz, anti-collision and 16-bit CRC features, ISO/IEC 14443B (Parts 1 to 4) at 106, 212 and 424 kbps, compliance with ISO/IEC 7816-3 T=0, dual or contactless-only configuration, DES, DESX and TDES capability, full transaction duration, including typical terminal processing compliant with public transportation requirements, Common Criteria EAL5+, EMVCo™ certification, etc.

STRFNFCA Near field communication transceiver is a product launched by STMicroelectronics. It supports reader/writer, card emulation and peer-to-peer modes. The hardware features include a dedicated internal frame controller, a highly integrated analog front end (AFE) for RF communications, transmission and reception modes.

ST33TPM12LPC is a single-chip Trusted Platform Module (TPM) with an LPC interface based on a 32-bit ARM® SecurCore® SC300™ CPU. It is compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Main specifications 1.2, Level 2, Revision 116 and TCG PC Client Specific TPM Interface Specifications 1.21. The module supports security certification and features such as low power mode, upgrade protection, and dictionary attack protection.

The ST23YR04 is a dual contactless smartcard MCU from STMicroelectronics with 4Kbytes EEPROM, enhanced security, cryptoprocessor and optimized RF performance.

This document describes the features and characteristics of the STM7007 single-chip hardware accelerated encryption engine, including world-class encryption engine, support for symmetric and asymmetric algorithms, PCI Express interface, etc.

ST19NP18-TPM is a single-chip Trusted Platform Module (TPM) with embedded TPM 1.2 firmware. It features a 33-MHz Low Pin Count (LPC) interface V1.1 and is compliant with TCG PC client specific TPM Implementation Specification (TIS) V1.2. It is based on the ST19N Secure-Smartcard IC platform and includes a reliable CMOS EEPROM submicron technology. The module supports RSA 1024-bit signature and verification.

ST23R160 is a security smartcard MCU with AES accelerator, 160-Kbyte EEPROM and dual or contact-only interface launched by ST.

ST33TPM12I2C is a Trusted Platform Module (TPM) based on 32-bit ARM® SecurCore® SC300™ CPU with I2C interface, which is compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Main specifications 1.2, Level 2, Revision 116 and TCG PC Client Specific TPM Interface Specifications 1.21. This module features single-chip TPM, embedded endorsement key and endorsement key certificate, support for clock suspension, support for field upgrade and dictionary attack protection, support for software and hardware physical presence, support for temperature range from 0°C to +70°C, support for ESD protection up to 4 kV (HBM), support for 3.3 V supply voltage range, support for 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ECOPACK® packages.