Industrial Manuals

This document introduces NXP Semiconductors' portfolio of LED solutions for gaming, mobile, signage, LCD TV backlighting, LED indication, and more. These solutions are designed for high performance, low cost, high power efficiency, and flexible design. They also include Fast-mode Plus, a wide supply range (2.3 to 5.5 V), and flexible PWM functions. They also have ultra-low standby modes (<1 µA), low CPU overhead, and extended battery life in mobile applications. These solutions also include application boards and daughter cards, and have a mature manufacturing infrastructure that supports high volumes. They provide everything you need to make lighting affordable, from mobile handsets and gaming systems to outdoor billboards, signage, and more.

UBA3070 is a high-voltage LED control IC launched by NXP. It is specially designed for applications where large numbers of LEDs have to be driven accurately and efficiently. It is the perfect choice for LCD backlighting systems.

NXP's ADC1415Sxxx is a single-channel 14-bit ADC that supports up to 125 MSPS sampling rates and features excellent dynamic performance, along with a low-power BiCMOS input buffer for use in high-IF applications.

The TEA1522 is a low-power switched-mode power supply (SMPS) controller IC from NXP. It features high efficiency, low standby power (< 100 mW), low EMI, and small footprint. The chip can be used for USB chargers, small power supplies, white goods, small personal care equipment, portable equipment chargers, coffee machines, security cameras, and general household appliances.

ICODE SLI-S is a smart label IC from NXP company that supports ISO 15693, ISO 18000 and HF EPCglobal/Auto ID standards. It offers password-protected memory access that can be tailored to meet your specific needs. In addition, the ICODE SLI-S features increased user memory. So you can use 32-bit or 64-bit passwords for even higher security in your applications.

The NXP ARM7 series microcontrollers integrate an LCD controller, with powerful performance and a wide range of applications in consumer, entertainment, industrial/commercial, medical and automotive applications.

MicroPak and MicroPak II packages are the world's smallest packages for single-, dual-, and triple-gate logic. They are 65% - 74% smaller than their PicoGate equivalents and offer a larger pad size that provides a more rugged and reliable bond between the device and the PC board.

NXP's payment solutions offer financial institutions, card manufacturers and consumers a variety of secure, reliable and attractive solutions.

This document introduces the NXP CATV C-family products, including BGY588C, BGE788C, and CGY888C push-pull amplifiers, BGD712C, CGD944C, and CGD942C power doublers, and BGO807C optical receiver. These products are compliant with the Chinese State Administration for Radio, Film and Television (SARFT) standard and provide excellent linearity, stability, and reliability for cable TV networks in China.

The OM11055 is a PCF8883 evaluation board which can be used to demonstrate and evaluate the PCF8883 capacitive proximity switch. The PCB is designed to make it easy to adjust the switch’s sensitivity. The board can be powered using a Mini USB cable or a 9V battery.

NXP Voltage Translators (NVT) are used in bidirectional signaling voltage level translation applications for I/O buses with incompatible logic levels. The NVT2001 and NVT2002 are single- and dual-channel voltage translators, operational from 1.0 V to 3.6 V at VCC(A) (low voltage side) and 1.8 V to 5.5 V at VCC(B) (high voltage side) without direction control for open-drain or push-pull I/O devices.

This document discusses factors that need consideration when an I2C-bus is used to communicate between two points that do not share a common logic ground potential. I2C logic signals are referenced to a ground level and it is expected that connected devices share that reference. In practice, when an I2C-bus is extended to link devices that are separated by distances exceeding about 1 meter there can be many factors that cause differences in the local ground potential of those devices and that in turn affects the noise margins of the system and can lead to device ratings being exceeded. In other cases, where an I2C-bus could provide an attractive data link there is no possibility for a shared ground reference. Examples include the need to provide safety isolation between the I2C control signals and AC mains power, telephone lines, or patient monitoring medical equipment. In other cases, such as Power over Ethernet, standards require isolation of the grounds. Solutions are provided to deal with ground differences ranging from less than 1 V up to kilovolt levels by using Opto or transformer isolators in the signal path. Key to all solutions is the availability of I2C isolation devices.

This is a technical manual about SOT687-1 FOOTPRINT (REFLOW SOLDERING)

The document provides detailed information about Philips Semiconductors PC board footprint SC-75; SC-89 FOOTPRINT (REFLOW SOLDERING).