Hardware design guide for the ZTE MG2639_V3 module covering interfaces, dimensions, electrical specs and PCB layout.
The ZTE MG2639_V3 User Manual provides detailed hardware design information for the GSM/EGSM/DCS/PCS module with integrated GPS/GLONASS/Beidou. It includes functional descriptions, interface definitions, electrical characteristics, and mechanical dimensions to assist system, hardware and software engineers.
Key sections cover external interface specifications (UART, I2C, SPI, PCM, USB, ADC, PWM, LCD, GPS, charging, SIM), PCB design guidelines, mounting and baking processes, and mechanical drawings of the module package.
| Frequency bands | GSM850/EGSM900/DCS1800/PCS1900 |
|---|---|
| GPS support | GPS/GLONASS/Beidou |
| Dimensions (L×W×H) | 30.0 × 25.0 × 3.0 mm |
| Weight | <6 g |
| Operating temperature | -35 °C to +75 °C |
| Operating voltage | 3.4 V to 4.2 V |
| Standby current | 24 mA @ -75 dBm |
| Sleep current | 1 mA |
| Maximum TX power (GSM850/EGSM900) | Class 4 (2 W) |
The module measures 30.0 mm × 25.0 mm × 3.0 mm.
The module operates from 3.4 V to 4.2 V.
The module weighs less than 6 g.