The ZTE MF210 Module Hardware User Guide provides specifications, interface definitions, electrical and RF characteristics, and design recommendations for…
This guide describes the hardware design requirements for the ZTE MF210 PCI‑Express Mini Card module. It covers mechanical dimensions, electrical power specifications, interface pin definitions, and RF performance parameters to help developers integrate the module into their products.
Key sections include product technical parameters, detailed pin‑out and signal definitions, power supply design, USB and SIM interfaces, RF antenna guidelines, and recommended PCB layout and EMC/ESD practices. The document also lists testing standards, reliability data, and upgrade procedures. This manual is written in Chinese.
| Dimensions | 51mm × 30mm × 4.7mm |
|---|---|
| Weight | ≈10 g |
| Package Type | PCI Express Mini Card |
| Processor Architecture | ARM9 |
| SIM Interface | (U)SIM/SIM Standard 6‑PIN |
| Memory | 32 MB / 64 MB SDRAM/NAND |
| USB Interface | USB 2.0 High Speed |
| Maximum Power Consumption | 2.3 W |
| Supply Voltage | 3.3 V DC |
| Standby Current | ≈3.9 mA |
| Supported GSM Bands | 850/900/1800/1900 MHz |
| UMTS Power Class | Class 3 (+24 dBm) |
The MF210 measures 51 mm × 30 mm × 4.7 mm and weighs about 10 g.
The module’s standby (SLEEP) current is approximately 3.9 mA.
It supports GSM/EDGE/GPRS bands at 850 MHz, 900 MHz, 1800 MHz and 1900 MHz.
The module can be upgraded via its USB port or by using a dedicated upgrade fixture.