This datasheet describes the YiFeng YPA45-0618 C1, a 6-18GHz driver amplifier chip with 21dB gain and 22dBm saturated output power.
The YiFeng YPA45-0618 C1 is a driver amplifier chip designed for operation in the 6 to 18 GHz frequency range. It operates with a +5V power supply and provides a gain of 21dB along with a saturated output power of 22dBm. The chip features a metalized back suitable for conductive adhesive bonding or eutectic bonding processes. It utilizes an on-chip metalized through-hole technology to ensure good grounding, eliminating the need for additional external grounding measures. This manual is written in Chinese.
| Operating Frequency | 6 GHz ~ 18 GHz |
|---|---|
| Gain | 21dB |
| 1dB Compression Point Output Power | 21dBm |
| Saturated Output Power | 22dBm |
| Input Return Loss | -10dB |
| Output Return Loss | -10dB |
| Static Current | 149mA |
| Input/Output Impedance | 50Ω |
| Chip Size | 1.27 mm x 1.27 mm x 0.1 mm |
| Maximum Input Power | 10dBm |
| Maximum Drain Voltage | +6V |
| Storage Temperature | -65℃~+150℃ |
| Operating Temperature | -55℃~+125℃ |
| Sintering Temperature | 300℃ |
The chip operates in the frequency range of 6 GHz to 18 GHz.
The chip operates with a +5V power supply.
The saturated output power is 22dBm.
The metalized back is suitable for conductive adhesive bonding or eutectic bonding processes.