UniIC SCB15H2G80/160AF DDR3 SDRAM Datasheet

Technical data sheet for the UniIC SCB15H2G80/160AF 2‑Gbit DDR3 SDRAM memory component.


UniIC SCB15H2G80/160AF DDR3 SDRAM Datasheet - cover page
Brand
UniIC
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
57
File format
PDF
File size
1.9 MB
Published
28 September, 2026
Updated
28 September, 2026
MD5 checksum
1C2AEC6FD0E521C2386A74813284007D

About this manual

The UniIC SCB15H2G80/160AF DDR3 SDRAM is a 2‑Gbit memory device available in x8 and x16 configurations. The data sheet provides detailed specifications, features, package information, and electrical characteristics for designers.

Key sections cover addressing, package ball‑out, input/output signal descriptions, operating conditions, speed bins, timing parameters, and IDD power consumption. The document also includes product nomenclature and ordering information for various temperature‑grade variants.

What's inside

  • Overview
  • Features
  • Product List
  • DDR3 SDRAM Addressing
  • Package Ball out
  • Input/Output Signal Functional Description
  • Operating Conditions and Interface Specification
  • Speed Bins, AC Timing and IDD
  • Package Outlines
  • Product Type Nomenclature

Specifications

Supply voltage (VDD, VDDQ)1.5 V ± 0.075 V (compatible with 1.35 V operation)
Data rates1066 Mbps / 1333 Mbps / 1600 Mbps
CAS latency (CL)5‑13
Package (x8)PG‑TFBGA‑78
Commercial temperature range0 °C to 95 °C
Page size (x8)1 KB
Page size (x16)2 KB

Frequently asked questions

What is the supply voltage for VDD and VDDQ?

The device operates at 1.5 V ± 0.075 V and is backward compatible with 1.35 V operation.

What data rates does the SCB15H2G80/160AF support?

It supports data rates of 1066 Mbps, 1333 Mbps, and 1600 Mbps.

What temperature ranges are available for this DDR3 SDRAM?

Commercial range 0 °C‑95 °C, Industrial –40 °C‑95 °C, Automotive A1 –40 °C‑125 °C, A2 –40 °C‑105 °C, A3 –40 °C‑95 °C, High‑Reliability X –55 °C‑125 °C.

Which packages are used for the x8 and x16 versions?

The x8 version uses a PG‑TFBGA‑78 package, while the x16 version uses a PG‑TFBGA‑96 package.

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