Technical product information for TAMURA ELSOLD SN100Ag MA-S lead-free solder alloys designed for wave and selective soldering processes.
This document provides technical details for the TAMURA ELSOLD SN100Ag MA-S series of microalloyed lead-free solders. These alloys are engineered to replace traditional tin/lead options in electronic manufacturing, offering benefits such as good wetting properties, a smooth and shiny surface finish, reduced copper leaching, and significantly diminished dross formation.
| Composition (SN100Ag0.3 MA-S) | Sn 99.0, Ag 0.3 ± 0.2, Cu 0.7 ± 0.2 |
|---|---|
| Composition (SN100Ag1 MA-S) | Sn 98.3, Ag 1.0 ± 0.2, Cu 0.7 ± 0.1 |
| Composition (SN100Ag3 MA-S) | Sn 96.5, Ag 3.0 ± 0.2, Cu 0.5 ± 0.2 |
| Melting Point Range | 217 – 227 °C (SN100Ag0.3) |
| Density | 7.33 g/cm³ (SN100Ag0.3) |
| Shelf Life | Minimum of 60 months from manufacturing date |
They offer good wetting properties, a smooth and shiny surface, reduced copper leaching, and significantly diminished dross formation.
Typical soldering temperatures range from 255 to 265 °C, with up to 320 °C for selective soldering.
The specification is in accordance with EN 61190-1-3, ISO 9453 and IPC J-STD 006C.