Installation guide for the AN8005 power semiconductor module, covering surface preparation, thermal paste application, bolt torque, and safety precautions.
This guide explains the proper installation steps for the AN8005 power semiconductor module to ensure reliable operation and long life. It covers cleaning the mounting surface, selecting the correct position, applying thermal paste, and securing the module with bolts.
Additional sections detail the installation of PCB self‑tapping screws, busbar mounting, force limits for power and control terminals, and other important precautions such as avoiding excessive torque, moisture, and corrosive environments. This manual is written in Chinese.
| Maximum surface roughness | 10 µm |
|---|---|
| Maximum flatness deviation | 20 µm over 10 cm |
| Thermal paste thermal resistance | ≈60 °C/W/in |
| Thermal paste thickness | 50‑100 µm |
| Initial hand‑tightening torque | ≈0.5 N·m |
| Final bolt torque | 3‑6 N·m |
| Bolt effective length | 6.5‑10 mm |
| Maximum pull force (half‑bridge power terminal) | 200 N |
| Maximum pull force (control terminal) | 50 N |
| Maximum pressure (half‑bridge power terminal) | 100 N |
The thermal paste should be applied as a thin, uniform layer with a thickness between 50 µm and 100 µm.
Power terminals may not experience a pull force greater than 200 N (half‑bridge) or 100 N (single switch), and control terminals are limited to 50 N.