A solvent-free, low-hardness encapsulation material for high-power LED fill and moisture protection of electronic components.
The Shinyun Li-1305A/B is a two-component, solvent-free encapsulation material designed for high-power LED fill applications. It features low hardness (Shore A), excellent adhesion to various substrates, and good resistance to cracking. The material is suitable for coating, casting, sealing, and potting to protect photoelectric products from moisture, water, and contamination.
The product consists of Part A and Part B, which must be mixed in a 1:1 ratio. After degassing, the mixture is poured into the target area and cured naturally for 24 hours. It offers a refractive index of 1.41 and a light transmittance of 100%. Users should note that certain chemicals, such as organic tin, sulfur, amines, and certain flux residues, can inhibit curing. This manual is written in Chinese.
| Viscosity (Mixed) | 1000±500 cps at 25℃ |
|---|---|
| Mixing Ratio | 1:1 |
| Standard Cure Condition | Natural cure 24 hours |
| Refractive Index | 1.41 at 25℃ |
| Hardness | Shore A |
| Pot Life | ≤3h at 25℃ |
| Light Transmittance | 100% |
Add 100 parts of Part B to 100 parts of Part A and stir carefully until uniform.
It is a solvent-free product designed for filling high-power pseudo-lumen LED light sources and for coating, casting, sealing, and potting protection of precision electronic components or modules.
The product requires a mixing ratio of 1 part A to 1 part B.
The product cures naturally over a period of 24 hours.