A teardown report detailing the internal components, specifications, and PCB layout of the Samsung Galaxy S4 LTE-A smartphone.
This document is a teardown report for the Samsung Galaxy S4 LTE-A (model SHV-E330L), prepared by Fomalhaut Techno Solutions. It provides detailed information about the device's specifications, internal structure, and hardware components. The report includes details about the CPU, display, battery, communication protocols, and other key parts used in the device.
The document features a comprehensive list of components found within the phone, including the Qualcomm MSM8974 processor, Samsung memory chips, and various sensors. It also provides specific dimensions and markings for Printed Circuit Boards (PCBs) and individual parts like the camera modules, battery, and wireless communication chips.
| Product Name | Galaxy S4, SHV-E330L |
|---|---|
| CPU | Qualcomm MSM8974, quad core, 2.3GHz |
| RAM | 2048MByte |
| ROM | 32GByte |
| Main Display | 5.0-inch, 1080 x 1920 dot, OLED |
| Main Camera | 13.0MP CMOS with auto focus, flash LED |
| Sub Camera | 2.0MP CMOS |
| Battery | Lithium Ion, 3.8V, 2600mAh |
| OS | Android 4.2 |
| Weight | 131g |
| Release Date | 2013.09.01 |
The maximum HSDPA speed is 150Mbps.
The maximum HSUPA speed is 50Mbps.
Yes, the device supports NFC.
The maximum MicroSD capacity is 64GByte.