Technical specifications and application examples for ODU's MINI-FLAKAFIX board-to-cable connector grid with 1.27 x 2.54 mm spacing.
This document details the technical specifications, soldering methods, and mechanical properties of the ODU MINI-FLAKAFIX board-to-cable connector grid. It covers applications in hospital communication systems, photographic equipment, and medical devices. The connector supports SMT and wave soldering, with coplanarity less than 0.1 mm and contact resistance under 6 mΩ. Two locking systems are available: metal clip or latches.
The connector is RoHS-compliant, designed for high-temperature soldering (up to 260°C), and suitable for frequencies up to 1 GHz. It features low insertion force, high mating cycles (>100), and reliable signal integrity for high-frequency applications. This manual is written in German.
| Contact Resistance | ≤6 mΩ |
|---|---|
| Test Voltage | 750 Volt eff. |
| Operating Voltage | 30 V |
| Operating Current | 0.5 A (Single contact at 25°C) |
| Operating Temperature | -40°C to +125°C |
| Humidity | 75% rel. Humidity to DIN 40 040 / MIL-C-21 097B |
| Insertion Force | 0.18 N/Contact |
| Mating Cycles | > 100 |
| Contact Surface | 0.75 µm Au over 1.25 µm Ni |
| SMT Solder Temperature | 260°C (max. 30s on solder area) |
| Coplanarity | <0.1 mm |
The operating temperature ranges from -40°C to +125°C.
The contact resistance is ≤6 mΩ.
The mating force is approximately 0.1 N per contact.