The MPI TS200 Manual Probe System data sheet provides specifications, dimensions, electrical and thermal chuck details, and facility requirements.
The TS200 Manual Probe System is designed for a wide variety of applications such as RF, mmW, device characterization, wafer‑level reliability, high‑power and failure analysis. It features a puck‑controlled air‑bearing stage, interchangeable chucks (thermal and non‑thermal) and a rigid platen that can hold up to 10 DC or 4 RF positioners.
The data sheet lists travel ranges, resolution, electrical isolation, temperature stability, power consumption, physical dimensions and weight. It also includes electrical and compressed‑air supply requirements, as well as regulatory compliance and warranty information.
| Travel range (Chuck XY Stage) | 240 x 315 mm |
|---|---|
| Fine‑travel resolution | < 1.0 µm |
| Theta travel (standard) | 360° |
| Maximum voltage between chuck top and GND | 500 V DC |
| Temperature stability (thermal chucks) | ±0.5 °C |
| System weight | ~88 kg |
| System dimensions (W × D × H) | 690 x 585 x 665 mm |
The maximum voltage between the chuck top and ground is 500 V DC.
The TS200 system weighs approximately 88 kg.
The thermal chucks maintain temperature stability of ±0.5 °C.