The KW 4T glue coating machine user manual explains overview, operation steps, safety precautions, and cleaning procedures.
The KW 4T glue coating machine is designed for semiconductor, plate making and surface coating processes. It provides six adjustable speed settings and low‑noise operation, supporting wafer sizes from Φ5 mm to Φ200 mm depending on the model.
The manual details how to power the unit, select speed and time stages, start and stop the process, and perform regular cleaning and maintenance to ensure reliable performance. This manual is written in Chinese.
| Number of speed settings | 6 |
|---|---|
| Power supply | 220 V AC |
| Supported wafer size (4T model) | Φ5 mm – Φ100 mm |
| Supported wafer size (5 model) | Φ100 mm – Φ200 mm |
Press the front‑panel POWER key, then press the “吸片” (suction) key and finally the “开始” (start) key after the indicator turns green.
Immediately clean the suction chamber by removing the wafer holder, loosening the optical disc screws, and wiping the chamber with alcohol or acetone.
Ensure the pump is correctly connected and turned on before the device runs.