Technical data and guidelines for the SN100C lead-free tin/copper/nickel/germanium alloy, covering composition, quality control, and effects of circuit…
This document provides technical specifications for the SN100C lead-free solder alloy, which is a tin/copper/nickel/germanium composition used in wave and selective solder applications. It details the chemical composition of the alloy and associated additives like SN100Ce and AO1000.
| Tin (Sn) | Remainder |
|---|---|
| Copper (Cu) | 0.60 –0.70% |
| Nickel (Ni) | 0.04 –0.07% |
| Germanium (Ge) | 0.010% max |
| Recommended Copper Range | 0.50 – 0.85 |
| Recommended Nickel Range | 0.02 – 0.07 |
| Recommended Germanium Limit | 0.010 max |
| Recommended Aluminum Limit | 0.002 max |
| Recommended Lead Limit | 0.10 max |
It is used in wave and selective solder applications, as well as solder paste, wire solder, lead tinning, and hot air solder level applications.
Occasional additions of AO1000 additive might be required to increase the germanium concentration.
The solder can become dull looking and the melting point increases closer to that of pure tin.
There are no major issues, but there is no added benefit above a germanium content of about 0.010% by weight.