Epoxy Resin PX900D/BK

PX900D/BK is a low viscosity unfilled epoxy resin system designed for use in the electronics industry for applications requiring high levels of insulation resistance, chemical resistance and elevated temperature use. Capable of room temperature curing, the resin exhibits relatively high heat distortion temperatures.

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Published
02 November, 2023
Updated
02 November, 2023
MD5 checksum
811323D4DB0249FCA34876D56AEE6AC6
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Epoxy Resin PX900D/BK PDF
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