ABM's High Resolution Mask Aligner is a very versatile instrument with interchangeable light filters that allow Near-UV (405-365 nm) as well as Mid- and Deep-UV (254 nm, 220 nm) exposures in proximity (non-contact) or contact (soft & hard) modes. The exposure can cover an area 200mm in diameter. The bottom-mount mask system accommodates masks up to 9 inches square and substrates from small chips to wafers up to 200mm. The alignment tooling system also features an air-bearing substrate-to-mask planarization system for wedge-error compensation. The printing resolution is 0.8 µm for Near-UV and 0.4 µm for Mid-UV and Deep-UV in vacuum contact mode.
