This document introduces the features and characteristics of CHIMEI KIBISAN® SAN products.
CHIMEI KIBISAN® SAN is a transparent copolymer of styrene and acrylonitrile distributed by Entec Polymers. The material combines the clarity, stiffness, and processability of styrene with the hardness, heat resistance, and chemical resistance provided by acrylonitrile.
The guide lists specific physical properties such as density, melt flow rate, tensile strength, and thermal characteristics (HDT, Vicat) alongside recommended processing parameters including drying, rear, middle, front, and mold temperatures for injection molding and extrusion applications.
| Density | 1.06 g/cm³ |
|---|---|
| Melt Flow Rate (200°C/5kg) | 3.0 to 15 g/10 min |
| Tensile Strength at Yield | 65 to 74 MPa |
| HDT at 1.8 Mpa, Unannealed | 88 to 90 °C |
| Drying Temperature | 75 to 80 °C |
| Mold Temperature | 40 to 60 °C |
It is a transparent copolymer of styrene and acrylonitrile.
Common markets include automotive, housewares, appliances, healthcare, cosmetics, and sanitary products.
The recommended drying time is 3 to 4 hours.