This document describes the features, absolute maximum ratings, electro-optical characteristics, ranks, characteristic diagrams, soldering profile, outline dimension, packing, reel packing structure, precautions for use, and RoHS information of the TWH104-H# CHIP LED device.
This document is a technical datasheet for the Seoul Semiconductor TWH104-H# Chip LED Device. It provides comprehensive specifications including absolute maximum ratings, electro-optical characteristics such as luminous intensity and chromaticity coordinates, and product ranking criteria based on these parameters.
The guide also covers practical application details, including soldering profiles for leaded and lead-free processes, outline dimensions with recommended PCB patterns, reel packing structures, and specific precautions for storage and handling to ensure optimal performance.
| Package Dimensions | 1.6 × 0.8 × 0.4 mm |
|---|---|
| Power Dissipation (Pd) | 70 mW |
| Forward Current (IF) | 20 mA |
| Peak Forward Current (IFM) | 60 mA |
| Reverse Voltage (VR) | 5 V |
| Operating Temperature (Topr) | -30 ~ 80 ℃ |
| Luminous Intensity (Typical) | 150 mcd |
| Viewing Angle | 160° |
The typical luminous intensity (IV) at IF=5mA is 150 mcd, with a range from 100 to 220 mcd.
For lead-free solder, the maximum operation heating temperature is 260°C for a duration of 10 seconds.
Unused components must be soldered within seven days after opening the moisture-proof packing.