WEITRON SMCJ Series handbook

Update: 29 September, 2023

This document introduces a low profile package device for surface mounted applications, which features built-in strain relief, glass passivated junction, low inductance, and excellent clamping capability. It is lightweight, compact in size, suitable for high temperature soldering, and has good flame retardancy.

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File format: PDF

Size: -

MD5 Checksum: 7DB060FC71C2952F5708FF4A3E36560A

Publication date: 01 June, 2012

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PDF Link: WEITRON SMCJ Series handbook PDF