EDR series E155181(R) SIP (PIN OUT:1357) DIP SMD SIP (PIN OUT:1267) HIGH INSULATION (DIP) HIGH INSULATION (SMD) is a miniature, cost-effective switching solution. It has the following features: molded construction for compatibility with automatic board processing; completely washable; DIP type construction with the same terminal pitch as ICs or TTLs; high sensitivity allows direct driving by TTL, etc.; magnetic shield cover is available.
The Reed EDR Series is a miniature, cost‑effective relay designed for automatic board processing. It features a molded construction, washability, and a dip‑type package with the same terminal pitch as ICs or TTLs, allowing direct TTL drive. Optional magnetic shield covers are also available.
The datasheet lists detailed electrical specifications such as nominal voltages (5 VDC, 12 VDC, 24 VDC), contact forms, switching and carry currents, power ratings, temperature ranges, and mechanical dimensions for SIP, DIP, and SMD packages, along with wiring diagrams for each type.
| Nominal Voltage | 5 VDC, 12 VDC, 24 VDC |
|---|---|
| Contact Form | 1A: Open type, 1 form A |
| Switching Current | 0.5 A max |
| Carry Current | 1.0 A max |
| Switching Power | 10 VA max |
| Maximum Voltage | 100 VDC max |
| Operating Temperature | -40 °C to +85 °C |
| Shock Resistance | 30 g min |
The relay is offered for 5 VDC, 12 VDC, and 24 VDC nominal voltages.
The maximum switching current is 0.5 A (ADC) per contact.
It operates from –40 °C up to +85 °C.