TECHNOLOGY GS8322V18(B/E)/GS8322V36(B/E)/GS8322V72(C) 2M x 18 1M x 36 512K x 72 36Mb S/DCD Sync Burst SRAMs 250 MHz 133 MHz 1.8 V VDD 1.8 V I/O

GS8322V18/36/72 is a 37,748,736-bit high performance synchronous SRAM with a 2-bit burst address counter. Although of a type originally developed for Level 2 Cache applications supporting high performance CPUs, the device now finds application in synchronous SRAM applications, ranging from DSP main store to networking chip set support.


TECHNOLOGY GS8322V18(B/E)/GS8322V36(B/E)/GS8322V72(C) 2M x 18 1M x 36 512K x 72 36Mb S/DCD Sync Burst SRAMs 250 MHz 133 MHz 1.8 V VDD 1.8 V I/O - cover page
Brand
Technology
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
42
File format
PDF
File size
1 MB
Published
04 May, 2012
Updated
30 September, 2023
MD5 checksum
D4CF835155D4DADA27670B2D7FEA7F1D

About this manual

The GS8322V series from GSI Technology provides high‑performance synchronous burst SRAMs for Level‑2 cache, DSP main store, and networking chip‑set applications. The devices are offered in three capacities – 2 M × 18, 1 M × 36, and 512 K × 72 bits – and support both pipeline and flow‑through read modes.

Key features include IEEE 1149.1 JTAG‑compatible boundary‑scan, selectable FT (Flow‑Through/Pipeline) mode, ZQ pin for high/low drive strength, automatic power‑down, and both byte‑write (BW) and global‑write (GW) operations. The parts are supplied in 119‑, 165‑, and 209‑pin BGA packages and operate from a 1.8 V core supply over commercial and industrial temperature ranges.

What's inside

  • Features
  • Functional Description
  • Applications
  • Pin Description
  • Parameter Synopsis
  • Ordering Information
  • Revision History

Specifications

Capacities2M × 18, 1M × 36, 512K × 72
Maximum operating frequency250 MHz (pipeline) – 133 MHz (flow‑through)
Core supply voltage1.8 V
I/O supply voltage1.8 V
Package types119‑, 165‑, 209‑pin BGA
Temperature rangeCommercial and Industrial
Write modesByte Write (BW) and Global Write (GW)
Power‑down featureAutomatic power‑down for portable applications

Frequently asked questions

What does the FT pin control?

The FT pin selects Flow‑Through mode (low) or Pipeline mode (high) for the SRAM’s data output path.

How can the device be put into low‑power mode?

The SRAM includes an automatic power‑down feature that activates when the device is idle.

Which write operations are supported?

Both Byte Write (BW) using individual byte enable pins and Global Write (GW) to write all bytes simultaneously are supported.

What is the purpose of the ZQ pin?

The ZQ pin selects high‑drive strength for multi‑drop bus applications or normal drive strength for point‑to‑point connections.

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