This document is an introduction and comparison of thermal conductive materials such as Gap Pad, Gap Filler, TIC, and Sil-Pad. The document lists the characteristics and test data of various materials, and provides material selection guides and frequently asked questions. These products all have good thermal conductivity and are suitable for heat dissipation and thermal conduction applications in electronic devices.
Bergquist is a world‑leading manufacturer of thermal management materials for electronics, automotive, aerospace, and other industries. This guide provides an overview of thermal properties, testing procedures, and the range of products the company offers.
The document details the Gap Pad, Sil‑Pad, Bond‑Ply, Hi‑Flow, and TIC families, includes comparison data, and answers frequently asked questions about conductivity, adhesive options, shelf life, and processing limits to help engineers select the right material for their applications.
| Shelf life (non‑adhesive Gap Pad) | 1 year |
|---|---|
| Shelf life (adhesive Gap Pad) | 6 months |
| Thermal conductivity test method | ASTM D5470 |
A test fixture that complies with ASTM D5470 was used.
Yes, certain Gap Pad products (VO, VO Soft, VO Ultra Soft) are offered with or without adhesive; all other Gap Pads have inherent tack.
Gap Pad can be reworked in many cases, but it depends on the application and the engineer’s judgment.