BERGQUIST Table of Contents 1 Introduction 2 Thermal Properties Testing 4 Interface Material Selection Guide

Update: 29 September, 2023

This document is an introduction and comparison of thermal conductive materials such as Gap Pad, Gap Filler, TIC, and Sil-Pad. The document lists the characteristics and test data of various materials, and provides material selection guides and frequently asked questions. These products all have good thermal conductivity and are suitable for heat dissipation and thermal conduction applications in electronic devices.

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File format: PDF

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MD5 Checksum: 79A6BB3BB120DA966D8A8E31A6F847FE

Publication date: 02 May, 2012

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PDF Link: BERGQUIST Table of Contents 1 Introduction 2 Thermal Properties Testing 4 Interface Material Selection Guide PDF