This document introduces Murata's LTCC multi-layer module boards, and provides examples of automotive and communication applications.
Murata's Low Temperature Co‑fired Ceramic (LTCC) technology provides multi‑layer glass‑ceramic substrates that are co‑fired with low‑resistance Ag or Cu conductors at a firing temperature of 890 °C. The unique zero‑shrinkage sintering process keeps dimensions stable in the X‑Y plane, delivering high dimensional accuracy, flatness and excellent electrical characteristics for automotive and RF applications.
The leaflet lists typical material properties such as bulk density, dielectric constant and thermal conductivity, and offers design support including CAD files, simulation tools, and detailed design rules for embedded RF functions, thermal management and high‑density interconnects. Application examples for automotive controller modules, RF front‑end modules and communication devices are also provided. This manual is written in Chinese.
| Firing temperature | 890 °C |
|---|---|
| Thermal conductivity (minimum) | 300 W/m·K |
The LTCC boards are fired at 890 °C.
Yes, they are Pb/Cd‑free and meet RoHS requirements.
Murata offers CAD files, simulation systems and detailed design rules for pattern layouts, embedded RF functions and thermal management.