AAVID Manuals

This document introduces Aavid Thermalloy's low-profile surface mount heat sinks, suitable for SMT power semiconductor devices in D-PAK, D2PAK, D3PAK, and SO-10 packages. Their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through-hole solutions. The semiconductor's conventional copper drain pad is modified to extend beyond the edges of the semiconductor package, providing space to mount the heat sink. The device and heat sink are soldered directly to the modified drain pad, creating a thermal conduction path.

This document describes a heat sink suitable for TO-220 packages. It features an economy narrow base, low profile, channel style design. The thermal resistance value is 24.00, based on a 75°C rise in natural convection. Detailed information about standard products is provided, along with options for customization.

DB120-20 and DB180-20 are black anodised DB extrusions, cut to length 120mm and 180mm, with top surface skimmed.