ATMEL MicroLeadFrame Packages Pad Landing Recommendations Application Note handbook

Update: 30 September, 2023

This application note provides guidelines for designing PCBs that mount Atmel’s DataFlash memories in MicroLeadFrame® packages. The MicroLeadFrame package is a leadless package where electrical contact to the PCB is made by soldering the lands on the bottom surface of the package to the PCB, instead of the conventional formed perimeter leads.

Brand: ATMEL

File format: PDF

Size: 740 KB

MD5 Checksum: 22152FDEDF4C232FF31BCE99235A62C7

Publication date: 27 March, 2012

Downloads: -

PDF Link: ATMEL MicroLeadFrame Packages Pad Landing Recommendations Application Note handbook PDF

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