NXP Semiconductors SOT1077-1 PC board footprint manual

Update: 28 September, 2023

This document provides information about the PC board footprint dimensions for NXP Semiconductors. It includes details about the solder land dimensions, solder paste occupied area, and the footprint pattern for reflow soldering of the LFBGA487 package.


File format: PDF

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MD5 Checksum: 0B8804BBDBDA8338697B6D343C78BF23

Publication date: 22 March, 2012

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