NXP Semiconductors SOT1085-1 PC board footprint manual

Update: 29 September, 2023

This document provides information about the PC board footprint dimensions of the NXP SOT1085-1 package. It describes the dimensions of the solder land and solder paste deposit, as well as the generic footprint pattern for reflow soldering.

File format: PDF

Size: -

MD5 Checksum: 6F93E0C086A92710C8E2307187AF7F5F

Publication date: 22 March, 2012

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PDF Link: NXP Semiconductors SOT1085-1 PC board footprint manual PDF

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