NXP Semiconductors SOT834-1 PC board footprint manual

Update: 28 September, 2023

This document describes the PCB board footprint for reflow soldering of the HSOP16F package produced by NXP B.V. in 2008. The document provides the dimensions and solder pad layout of the package.

Brand: NXP

File format: PDF

Size: 13 KB

MD5 Checksum: 40902D372DA9A033727E0096F1154234

Publication date: 22 March, 2012

Downloads: -

PDF Link: NXP Semiconductors SOT834-1 PC board footprint manual PDF

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