NXP Semiconductors SOT1107-1 PC board footprint manual

Update: 28 September, 2023

This document provides PC board footprint dimensions for NXP B.V. 2008. It includes solder land and solder paste dimensions for the LFBGA296 package, as well as a generic footprint pattern for reflow soldering. The document provides important information on product dimensions and soldering methods for users.

File format: PDF

Size: -

MD5 Checksum: 59AEEB9111E5D9F3197A8807AAC7820F

Publication date: 22 March, 2012

Downloads: -

PDF Link: NXP Semiconductors SOT1107-1 PC board footprint manual PDF

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