This document introduces the 73 series dual-in-line pin/slot/turret/solder cup headers, which are suitable for different wiring applications. It includes the 153 pin headers with 3 level wrap posts. It also introduces the 160/163 series with slotted heads for accepting wires or component leads; the 170/173 series with turret heads; and the 180/183 series with solder cups for wiring applications. The connectors are available with solder tail or 3 level wrap posts. The document provides different connector sizes and ordering information.
This document describes the features of the 66 Series 614 dual-in-line pin carrier assemblies, including low profile and low profile ultra-thin solder tail pin carrier assemblies. They provide maximum ventilation and better visibility for inspection and repair. The disposable plastic carrier allows for easy mounting without solder or flux wicking problems.
60 series 110…105161 / 114…161 / 150…106161 dual-in-line sockets and headers / open frame / surface mount pick and place specially designed for re- flow soldering including vapor phase. Insertion characteristics: receptacle 4-finger standard. New: pin connectors with selective plated precision screw machined pin, plating code Z1. Connecting side 1: gold plated soldering/PCB side 2: tin plated. Other platings on request. Other pin counts please consult
This document describes a product that uses dual-in-line sockets and an open frame wire-wrap connection technique. The socket is suitable for three-level wrapping and PCB soldering, and can also be used as an interconnect socket with intermediate wire-wrap connections. The document also includes custom length options.
