ST AN2048 APPLICATION NOTE handbook

Update: 30 September, 2023

This application note introduces a new chip-size packaging technology that enables power integrated circuits to be surface mount devices (SMDs), thus significantly reducing assembly costs and the size of power amplifier modules


File format: PDF

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MD5 Checksum: BB53A93E8DE559A4F089600735318BF9

Publication date: 06 August, 2012

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PDF Link: ST AN2048 APPLICATION NOTE handbook PDF

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