ST AN2034 handbook

Update: 28 September, 2023

The document discusses the semiconductor industry's transition towards lead-free packaging in accordance with new international regulations. It highlights the collaborative efforts of STMicroelectronics, Infineon Technologies, Philips Semiconductors, and Freescale (E4 group) to provide consistent and compatible solutions. The document provides detailed information on ST's lead-free finishing solutions for lead-frame based packages and ball grid array packages.

---

File format: PDF

Size: -

MD5 Checksum: 36CE27676CCFEE3CF1BC4E55D069B48D

Publication date: 06 August, 2012

Downloads: -

PDF Link: ST AN2034 handbook PDF