ST AN2036 handbook

Update: 30 September, 2023

This application note describes the solderability tests performed on STMicroelectronics lead-free devices, and how to form a reliable solder joint with the base material of the circuit board, using lead-free (Sn-Ag-Cu) or leaded (Sn-Pb) solder.


File format: PDF

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MD5 Checksum: C1A25C8D9CBFBF776B1F5D958CD7F242

Publication date: 06 August, 2012

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PDF Link: ST AN2036 handbook PDF

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