FAIRCHILD Assembly Guidelines for MicroFET 1.6x1.6mm Packaging handbook

Update: 30 September, 2023

This application note introduces the MicroFET 1.6x1.6 package technology, including MLP technology, package design, and assembly process

Brand: Fairchild

File format: PDF

Size: 530 KB

MD5 Checksum: 8EEA4FAEB757BC7019A1139ED875B3C0

Publication date: 12 July, 2012

Downloads: -

PDF Link: FAIRCHILD Assembly Guidelines for MicroFET 1.6x1.6mm Packaging handbook PDF

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